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In the packaging process of semiconductor chips, the semiconductor plastic sealing alloy can effectively protect the chip from physical and chemical damage, while providing good electrical connection and heat dissipation performance.

The laser can focus down to the micron level, enabling precise removal of photoresist without damaging the substrate. Non-contact processing does not place mechanical stress on wafers or other substrates, avoiding physical damage and deformation.

There is no need to use any chemical reagents, avoiding the generation and treatment of chemical waste liquid; It reduces the pollution to the environment and meets the requirements of modern industrial environmental protection.

The integrated automatic control and intelligent operation interface simplify the operation steps, and the fully automated handling system is configured. The two stations of the equipment can work simultaneously to improve the flexibility and response speed of the production line.